Composition

Material

White silicone thermal heatsink compound containing zinc oxide and polydimethyl siloxane.

Description and Properties

4g blister pack

This is another smooth silicone-based thermal compound with a non-grainy consistency.  It’s a bit “harder” than the other thermal compounds in this category but not to the point where it’s a hindrance to conductivity.

“Designed for use in transferring heat away from electrical and electronic devices such as:  transistors, power diodes, semi-conductors, ballasts, and thermocouple wells.”

  Thermal Conductivity                              .6576

  (W/ m*K)

  Electrical Conductivity                            Negligible 

Composition

Material

Ceramic-filled acrylic pressure- sensitive adhesive tape.

Description and Properties

1” x 6” strip

This is a bit different than the rest of the interface materials in the group.  This is a thermal adhesive tape that’s very thin.  It’s widely known as “frag-tape’ and commonly used for adhering heatsinks to video card chipsets and motherboard chipsets.

“The tape yields an excellent combination of thermal conductivity, electrical insulation, adhesion (with reworkability) and ease of use in applications that do not require a heat cured adhesive.”

  Thermal Conductivity                              .43

  (W/ m*K)

  Electrical Conductivity                           Negligible